India, April 20 -- India Electronics and Semiconductor Association (IESA) has hailed the 3DGS groundbreaking as India's big leap in advanced semiconductor packaging.

Ashok Chandak, President, IESA, and SEMI India, said IESA welcomed the inauguration of 3DGS Semicon's advanced packaging facility in Odisha by Union Minister Ashwini Vaishnaw and Chief Minister Mohan Charan Majhi, calling it a strong demonstration of India's shift from intent to execution in semiconductors.

The heterogeneous integration packaging solutions unit of 3D Glass Solutions marks a significant capability leap in advanced packaging-an area increasingly seen globally as critical as advanced process nodes.

It can help India move from semiconductor participation to se...