India, Feb. 19 -- Google's next-generation TPU, Ironwood, integrates a 3D Torus network topology with the Apollo optical circuit switch (OCS) all-optical network, marking a major step forward in AI data-center interconnect design.

TrendForce's latest research on the high-speed interconnect market indicates that this architecture will directly address the surging compute and bandwidth demands driven by large-scale AI workloads.

TrendForce estimates that the global shipment share of 800G and above optical transceiver modules will climb from 19.5% in 2024 to over 60% by 2026, positioning these modules to become standard components in AI-focused data centers.

In an OCS-enabled architecture, Ironwood TPUs rely on high-speed copper for short...