From silicon to scale: Aheesa signs packaging MoU with Optilink Networks
India, Sept. 9 -- Aheesa Digital Innovations, a DLI-scheme backed fabless semiconductor company headquartered in Chennai, has signed a Memorandum of Understanding (MoU) with Optilink Networks Pvt Ltd, onboarding the company as its packaging partner for VIHAAN-I, Aheesa's indigenous RISC-V broadband networking System-on-Chip (SoC).
The partnership marks another step towards commercializing VIHAAN-I, strengthening the pathway from indigenous chip design and silicon validation to packaging, distribution and market deployment.
The partnership brings together two complementary parts of the broadband technology ecosystem. Optilink has supported the VIHAAN-I journey through testing, validation and engineering support, with its in-house capabil...
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