India, Sept. 18 -- Europe has invested billions in its semiconductor industry. The decisive question now is how the pilot lines established under the EU Chips Act can create industrial value creation. Leading representatives from industry, research, and policymaking will discuss this at FIRST by FMD on September 30 and October 1, 2026, at the EUREF Campus in Berlin.

The APECS Pilot Line for Advanced Packaging and Heterogeneous Integration provides access to design, development, testing, and pilot production, helping move technologies from research to industrial application.

Prof. Dr. Holger Hanselka, President of the Fraunhofer-Gesellschaft, emphasizes that this transfer can succeed only through close collaboration between research and ...