India, Aug. 1 -- Fueled by booming demand for advanced packaging like CoWoS, a new report from China's Wallstreetcn is turning heads with claims of a breakthrough "CoWoP" (Chip on Wafer on PCB) tech-mounting chips directly onto PCB mainboards via mSAP processes, skipping IC substrates entirely.

However, Infotimes suggests that PCB manufacturers are taking these bold claims with a grain of salt, and securities firms say NVIDIA's Rubin Ultra likely won't adopt it.

CoWoP in a nutshell

As Wallstreetcn points out, CoWoP technology streamlines chip packaging by removing several traditional components from the CoWoS process like the package substrate and BGA (ball grid array) solder balls. Infotimes, on the other hand, breaks down the process...