India, April 27 -- Cadence has announced an expansion of its long-standing relationship with TSMC to accelerate AI-driven semiconductor innovation. The expanded collaboration will deliver IP, signoff-ready, end-to-end design infrastructure, and advanced, certified flows for leading-edge AI silicon on TSMC's N3, N2, A16TM and A14 process technologies.

The companies' enhanced work will help customers reduce iterations and improve correlation for DTCO-focused advanced AI and HPC designs-accelerating time to silicon with greater confidence. Customer momentum underscores the impact of this collaboration, with many early and mainstream companies actively designing on TSMC's 3nm or 2nm technologies.​

"AI silicon innovation at advanced no...