India, July 7 -- As demand for AI and HPC accelerates, the semiconductor industry is embracing a new era. With Moore's Law slowing and scaling challenges rising, technologies like 3DIC, panel-level fan-out (FOPLP), chiplets, and co-packaged optics (CPO) are becoming essential for next-level performance and system integration.

SEMICON Taiwan 2025 will spotlight these advances through global forums starting September 8, ahead of the main exhibition from September 10-12 at Taipei Nangang Exhibition Center.

Explosive growth in advanced packaging market redefines industry value chain

"Fueled by soaring AI demand, advanced manufacturing capacity is expected to hit a record 1.4 million wafers per month by 2028," said Terry Tsao, Global Chief ...