India, Aug. 20 -- Yole Group announced the release of the first edition of its Status of the Back-End Equipment Industry 2025 report. This new publication offers an unprecedented analysis of a segment undergoing structural change, driven by the rise of advanced packaging, AI acceleration, and heterogeneous integration.

As the complexity of chip manufacturing moves beyond front-end scaling, back-end equipment has emerged as a strategic focus for semiconductor innovation. The report covers the entire value chain, including die bonders, Flip Chip bonders, TCB, hybrid bonding, wire bonding, wafer thinning, dicing, and metrology & inspection.

Vishal Saroha, Technology & Market Analyst, Semiconductor Equipment at Yole Group, said: "This firs...