Pakistan, May 18 -- Samsung Electronics is reportedly developing advanced high-bandwidth memory (HBM) packaging technology for its future Exynos processors, a move expected to significantly improve on-device artificial intelligence performance in upcoming flagship smartphones.

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According to recent reports, the company is working on next-generation packaging known as Vertical Cu-post Stack technology, designed to bring HBM capabilities to mobile devices. HBM is currently widely used in servers and AI data centres due to its ability to deliver faster data transfer speeds and improved memory performance.

Industry analysts say integrating HBM into smartphones could substantially e...