New Delhi, July 26 -- The Government of Madhya Pradesh signs a MoU with Paras Semiconductors Pvt. Ltd., the semiconductor business of Paras Defence & Space Technologies Ltd., to establish a proposed Rs.6,200 crore semiconductor packaging facility in the state.

As part of the agreement, the state government has allotted 50 acres of land on the Ujjain-Indore Corridor for the proposed Outsourced Semiconductor Assembly and Test (OSAT) facility. The announcement was made on July 22.

According to the company, the project is expected to support India's semiconductor manufacturing ecosystem and generate employment in the state. The investment proposal is subject to project execution and regulatory approvals.

Paras Semiconductors said the propo...