Board of Mold-Tek Packaging approves bonus issue of 1:1
Mumbai, Aug. 26 -- The board of Mold-Tek Packaging at its meeting held on 26 August 2026 has approved issue of bonus shares in ratio of 1:1. The board also approved increase in authorised share capital from Rs 20 crore to Rs 40 crore dividend into 8 crore equity shares of Rs 5 each.
Published by HT Digital Content Services with permission from Capital Market....
Click here to read full article from source
इस लेख के रीप्रिंट को खरीदने या इस प्रकाशन का पूरा फ़ीड प्राप्त करने के लिए, कृपया
हमे संपर्क करें.