Taipei, May 4 -- Taiwan Semiconductor Manufacturing Co. (TSMC) sought government approval for an advanced wafer fab in the Longtan Campus of the Hsinchu Science Park. The park's bureau announced on Monday that it planned to submit a proposal for the third phase of the campus expansion later this month, marking a significant step for the world's largest contract chipmaker.

According to a report by Focus Taiwan, the Hsinchu Science Park Bureau said it will submit a proposal for the third phase of the Longtan Science Park, including plans for a TSMC fab, later this month to the National Science and Technology Council for review.

The move followed a period of shifting strategies for the company. The contract chipmaker previously bid to buil...