Taipei, June 18 -- Taiwan Semiconductor Manufacturing Co (TSMC) and US-based chip packaging and testing provider Amkor Technology have signed a 10-year agreement aimed at expanding advanced semiconductor packaging and testing capabilities in the United States, according to a news report by Focus Taiwan.

In a statement released Tuesday US time, Amkor said the partnership will support the development of a more integrated semiconductor supply chain in Arizona, where TSMC is investing heavily in chip manufacturing facilities, the report added.

Under the agreement, TSMC will procure advanced packaging and testing services from Amkor, which said growing demand for artificial intelligence (AI), high-performance computing (HPC) and other advanc...