San Francisco, July 25 -- Samsung Electronics and Broadcom on Saturday signed a memorandum of understanding (MoU) to expand their strategic collaboration across memory and foundry technologies, with the partnership expected to be worth more than USD 200 billion over the next five years through 2030.

The announcement was made during the AI Summit held at The Midway in San Francisco, where senior executives from both companies and representatives of the South Korean government were present.

According to a joint statement, the expanded collaboration is aimed at supporting the next generation of AI infrastructure by combining Samsung's capabilities in memory, foundry and advanced packaging with Broadcom's AI and connectivity technologies. ...