New Delhi, April 19 -- Union Minister Ashwini Vaishnaw, during the groundbreaking ceremony of India's first advanced 3D glass semiconductor packaging unit in Bhubaneswar, underlined the rapid transformation of railway infrastructure in Odisha, emphasising the government's strong focus on connectivity and capacity enhancement across the state.

Vaishnaw informed that railway projects worth over Rs 90,000 crore are currently under execution in Odisha, marking an unprecedented expansion of the rail network.

He highlighted that this scale of investment reflects the Centre's commitment to strengthening both passenger and freight infrastructure in the state.

During his visit to Odisha on Sunday, Vaishnaw inspected the ongoing redevelopment of...