New Delhi, July 22 -- In a major boost to semiconductor manufacturing in Madhya Pradesh, Paras Semiconductors has signed a Memorandum of Understanding (MoU) with the state government to set up a Rs 6,200 crore semiconductor packaging plant, according to an exchange filing by the company.

Under the agreement, the Madhya Pradesh government has allotted 50 acres of land along the strategically located Ujjain-Indore Corridor for the proposed semiconductor facility.

Paras Semiconductors, in its exchange filing, said, "Paras Semiconductors today signed a Memorandum of Understanding (MoU) with the Government of Madhya Pradesh to establish an advanced semiconductor packaging OSAT facility in the state."

The company said the project, backed by ...