New Delhi, April 19 -- Odisha took a major leap into the global semiconductor value chain on Sunday as Chief Minister Mohan Charan Majhi performed the groundbreaking for 3D Glass Solutions Inc.'s (3DGS) advanced chip packaging unit in Info Valley, Bhubaneswar, in the presence of Union Electronics and IT Minister Ashwini Vaishnaw and other distinguished guests. The facility is set to bring "world's most advanced technology" to Odisha, positioning the state in the "top-tier of chip packaging."

3DGS will set up a vertically integrated advanced packaging and embedded glass substrate unit that will bring "the world's most advanced packaging technology to India." The plant will host a wide range of next-generation technologies, including glass...