Bhubaneswar, April 19 -- The foundation stone for the country's first advanced 3D chip packaging unit was laid on Sunday at Info Valley, Bhubaneswar, Odisha.

The project marks a significant step towards strengthening India's domestic semiconductor ecosystem and advancing the vision of Atmanirbhar Bharat in high-end electronics manufacturing.

Union Minister for Electronics & IT Ashwini Vaishnaw said that the foundation stone of a semiconductor plant has been laid in Odisha on the occasion of Akshay Tritiya. He said the upcoming facility marks a significant step for high-tech manufacturing in the state, adding that he thanked Prime Minister Narendra Modi and Odisha Chief Minister Mohan Charan Majhi.

Calling it a matter of pride for Odish...