Khordha, April 19 -- US-based 3D Glass Solutions (3DGS), through its wholly owned Indian subsidiary Heterogenous Integration Packaging Solutions Pvt Ltd (HIPSPL), is implementing a greenfield, vertically integrated advanced packaging and embedded glass substrate ATMP facility at Info Valley, Khordha district in Odisha.

The project entails a total investment of Rs 1,943.53 crore, including eligible capex of Rs 1,598.33 crore. Approved central fiscal support amounts to Rs 799 crore, with additional state support of Rs 399.5 crore. The project is being funded through equity (Rs 745 crore), government support, with no external debt envisaged at this stage.

3DGS brings proprietary glass-ceramic packaging technology based on its APEX platform...