Exclusive

Publication

Byline

Location

INTERNATIONAL PATENT: MOTOROLA SOLUTIONS, INC. FILES APPLICATION FOR "IDENTIFICATION OF DEVICES TO PARTICIPATE IN SITE-WIDE CALL"

GENEVA, March 11 -- MOTOROLA SOLUTIONS, INC. (500 W. Monroe StreetChicago, Illinois 60661) filed a patent application (PCT/US2025/040510) for "IDENTIFICATION OF DEVICES TO PARTICIPATE IN SITE-WIDE CAL... Read More


INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "METHODS AND APPARATUS FOR MAPPING AND DEMAPPING A TRANSPORT BLOCK BASED ON LAYER SETS AND SUB-BANDS USING INTERLEAVING"

GENEVA, March 11 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/038205) for "METHODS AND AP... Read More


INTERNATIONAL PATENT: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. FILES APPLICATION FOR "BACKSIDE POWER DELIVERY ATTACHMENT"

GENEVA, March 11 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3025 Orchard ParkwaySan Jose, California 95134) filed a patent application (PCT/US2025/038923) for "BACKSIDE POWER DELIVERY ATTACHMEN... Read More


INTERNATIONAL PATENT: MASTERCARD INTERNATIONAL INCORPORATED FILES APPLICATION FOR "SYSTEMS AND METHODS FOR PROVIDING A BUY NOW, PAY LATER OFFER WITH OPEN BANKING"

GENEVA, March 11 -- MASTERCARD INTERNATIONAL INCORPORATED (2000 Purchase StreetPurchase, NY 10577) filed a patent application (PCT/US2025/038421) for "SYSTEMS AND METHODS FOR PROVIDING A BUY NOW, PAY ... Read More


INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "MULTIPLEXING FOR MEMORY PACKAGES WITH BUFFER DIE AND MODULES WITH SAME"

GENEVA, March 11 -- MICRON TECHNOLOGY, INC. (8000 South Federal WayBoise, Idaho 83716) filed a patent application (PCT/US2025/040939) for "MULTIPLEXING FOR MEMORY PACKAGES WITH BUFFER DIE AND MODULES ... Read More


INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "TECHNIQUES FOR HANDLING LOSS OF POSITIONING INFORMATION IN A CONNECTED STATE"

GENEVA, March 11 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/040383) for "TECHNIQUES FOR... Read More


INTERNATIONAL PATENT: DUPONT ELECTRONICS, INC. FILES APPLICATION FOR "AQUEOUS HEAT-TRANSFERABLE INKJET INK SETS AND PROCESSES FOR USING THE SAME"

GENEVA, March 11 -- DUPONT ELECTRONICS, INC. (974 Centre RoadWilmington, Delaware 19805) filed a patent application (PCT/US2025/039790) for "AQUEOUS HEAT-TRANSFERABLE INKJET INK SETS AND PROCESSES FOR... Read More


INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "CONDUCTION COOLING PLATE USING FRICTION STIR WELDING"

GENEVA, March 11 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/038578) for "CONDUCTION COOLING PLATE USING FRICTION STIR WELDING" ... Read More


INTERNATIONAL PATENT: RAKUTEN SYMPHONY, INC., RAKUTEN SYMPHONY USA LLC FILES APPLICATION FOR "AVOIDANCE AND ARBITRATION IN CONFLICT MITIGATION FUNCTIONALITY"

GENEVA, March 11 -- RAKUTEN SYMPHONY, INC. (1-14-1 TamagawaSetagaya-ku, Tokyo 158-0094), RAKUTEN SYMPHONY USA LLC (800 Concar DriveSan Mateo, California 94402) filed a patent application (PCT/US2025/0... Read More


INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "SYSTEM AND METHOD FOR CORRECTION OF HARDWARE ENTITY IDLE STATE MISPREDICTION"

GENEVA, March 11 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/038932) for "SYSTEM AND MET... Read More