INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "MULTIPLEXING FOR MEMORY PACKAGES WITH BUFFER DIE AND MODULES WITH SAME"

GENEVA, March 11 -- MICRON TECHNOLOGY, INC. (8000 South Federal WayBoise, Idaho 83716) filed a patent application (PCT/US2025/040939) for "MULTIPLEXING FOR MEMORY PACKAGES WITH BUFFER DIE AND MODULES WITH SAME" on Aug 06, 2025. With publication no. WO/2026/049957, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ROONEY, Randall J. (c/o Micron Technology, Inc.8000 South Federal WayBoise, Idaho 83716), PRATHER, Matthew A. (c/o Micron Technology, Inc.8000 South Federal WayBoise, Idaho 83716), VECHES, Anthony D. (c/o Micron Te...