ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,131, issued on March 31, was assigned to General Electric Co. (Evendale, Ohio) and Oliver Crispin Robotics Ltd. (Cheshire, Great Britain). ... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,069, issued on March 31, was assigned to TENCENT AMERICA LLC (Palo Alto, Calif.). "Low memory design for multiple reference line selection... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,067, issued on March 31, was assigned to Raytheon Co. (Arlington, Va.). "Method and apparatus for cooperative multi-target assignment" was... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,589,246, issued on March 31, was assigned to The Cleveland Clinic Foundation (Cleveland) and XII Medical Inc. (Union City, Calif.). "System an... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,588,994, issued on March 31, was assigned to Transmural Systems LLC (Andover, Mass.). "Devices, systems and methods for repairing lumenal syst... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,302, issued on March 31, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Generating AI-curated AR content based on ... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,649, issued on March 31, was assigned to HERE Global B.V. (Eindhoven, Netherlands). "System and method for age based processing of user da... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,062, issued on March 31, was assigned to Gilead Sciences Inc. (Foster City, Calif.). "PD-1/PD-L1 inhibitors" was invented by Evangelos Akt... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,491, issued on March 31, was assigned to Rubrik Inc. (Palo Alto, Calif.). "Investigation procedures for virtual machines" was invented by ... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,706, issued on March 31, was assigned to Micron Technology Inc. (Boise, Idaho). "Multi-chip package with enhanced conductive layer adhesio... Read More