US Patent Issued to Micron Technology on March 31 for "Multi-chip package with enhanced conductive layer adhesion" (Singaporean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,706, issued on March 31, was assigned to Micron Technology Inc. (Boise, Idaho).

"Multi-chip package with enhanced conductive layer adhesion" was invented by Hong Wan Ng (Singapore), Seng Kim Ye (Singapore), Kelvin Aik Boo Tan (Singapore) and Chin Hui Chong (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for multi-chip package with enhanced conductive layer adhesion are described. In some examples, a conductive layer (e.g., a conductive trace) may be formed above a substrate. An integrated circuit may be bonded to the conductive layer and an encapsulant may be deposited at least between the integrated circuit ...