ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,380, issued on Oct. 27, was assigned to Backblaze Inc. (San Mateo, Calif.). "Method and system to efficiently implement low latency uploads... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,381, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Apparatus and method with checkpoint data pr... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,382, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (South Korea). "Systems and methods of data staging for DRAM timing co... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,383, issued on Oct. 27, was assigned to NEXT SILICON LTD. (Givatayim, Israel). "System and method of managing access to a memory device" wa... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,384, issued on Oct. 27, was assigned to GRAPHCORE Ltd. (Bristol, Great Britain). "Computer system having multiple computer devices each wit... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,385, issued on Oct. 27, was assigned to SiFive Inc. (Santa Clara, Calif.). "Memory request combination indication" was invented by Eric And... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,386, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method and apparatus for scheduling I/O requ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,387, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Memory apparatus and operation method thereo... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,388, issued on Oct. 27, was assigned to Micron Technology Inc. (Boise, Idaho). "Cross-temperature measurement of a memory system" was inven... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,389, issued on Oct. 27, was assigned to Micron Technology Inc. (Boise, Idaho). "Proactive resilience to thermal events in a memory device" ... Read More