US Patent Issued to Micron Technology on Oct. 27 for "Proactive resilience to thermal events in a memory device" (Colorado, California Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,389, issued on Oct. 27, was assigned to Micron Technology Inc. (Boise, Idaho).

"Proactive resilience to thermal events in a memory device" was invented by Saideep Tiku (Fort Collins, Colo.) and Poorna Kale (Folsom, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure includes apparatuses and methods related to receiving, by a System-on-Chip (SoC) device, a command sequence and predicting a thermal event that likely corresponds to the received command sequence. The command sequence may include an instruction code that can be representative of a mode of operation of a vehicle. In one embodiment, a thermal model may be used to p...