ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,969, issued on Oct. 27, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device and method of manufacturing the ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,970, issued on Oct. 27, was assigned to Lumileds LLC (San Jose, Calif.). "Combined LED and sensor arrangement" was invented by Arjen Gerben... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,971, issued on Oct. 27, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device including driving voltage line" ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,972, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "3D semiconductor structure for wide... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,973, issued on Oct. 27, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "High-bandwidth package-on-package structure" was invented by... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,974, issued on Oct. 27, was assigned to Allegro MicroSystems LLC (Manchester, N.H.). "High voltage integrated circuit package with core" wa... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,975, issued on Oct. 27, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Low temperature direct bonding" ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,976, issued on Oct. 27, was assigned to TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) Co. LTD. (Xiamen, China). "Transfer substrate... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,977, issued on Oct. 27, was assigned to Tianma Advanced Display Technology Institute (Xiamen) Co. Ltd. (Xiamen, China). "Display panel and ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,978, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and method... Read More