US Patent Issued to Adeia Semiconductor Bonding Technologies on Oct. 27 for "Low temperature direct bonding" (California Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,975, issued on Oct. 27, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Low temperature direct bonding" was invented by Cyprian Emeka Uzoh (San Jose, Calif.), Jeremy Alfred Theil (Mountain View, Calif.), Thomas Workman (San Jose, Calif.) and Belgacem Haba (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a bonded structure is disclosed. The method can include providing a first element having a first non-conductive region and a first conductive feature, providing a second element having a second non-conductive region and a second conductive feature, bonding the first non-conductiv...