ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,949, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and manufacturing meth... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,950, issued on Oct. 27, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Electronic package" was invented by P... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,951, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure with connecting s... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,952, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and method of manuf... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,953, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Jae-M... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,954, issued on Oct. 27, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Shape memory polymer for use in semiconductor device fabrication"... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,955, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Integrated circuit device and method of manu... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,956, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Wet atomic layer etching method and method o... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,957, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and manufacturing... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,958, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structures and me... Read More