Exclusive

Publication

Byline

Location

US Patent Issued to SAMSUNG DISPLAY on April 14 for "Display device" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,059, issued on April 14, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Display device" was invented by Jaehoon Lee (... Read More


US Patent Issued to LG Display on April 14 for "Display device" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,060, issued on April 14, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Display device" was invented by Mangyu Park (Paju-si, ... Read More


US Patent Issued to MURATA MANUFACTURING on April 14 for "Electronic device" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,778, issued on April 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Electronic device" was invented by Takashi Iwamoto... Read More


US Patent Issued to MURATA MANUFACTURING on April 14 for "Electronic device" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,778, issued on April 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Electronic device" was invented by Takashi Iwamoto... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,779, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufa... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,779, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufa... Read More


US Patent Issued to Murata Manufacturing on April 14 for "Radio frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,780, issued on April 14, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "Radio frequency module and communication device" w... Read More


US Patent Issued to Murata Manufacturing on April 14 for "Radio frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,780, issued on April 14, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "Radio frequency module and communication device" w... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Package structure including guiding patterns" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,781, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure including guidi... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Package structure including guiding patterns" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,781, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure including guidi... Read More