ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,914, issued on April 21, was assigned to TDK Corp. (Tokyo). "Substrate processing apparatus" was invented by Yohei Sato (Tokyo), Hiroshi K... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,915, issued on April 21, was assigned to Little Feet Packaging Inc. (Wilmington, Del.). "Method and system for forming domed paper and str... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,916, issued on April 21, was assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Chengdu, China) and BOE TECHNOLOGY GROUP Co. LTD.... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,917, issued on April 21, was assigned to Borealis AG (Vienna). "Multilayer sheet comprising a foamed layer suitable for food packaging" wa... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,918, issued on April 21, was assigned to LG Chem Ltd. (Seoul, South Korea). "Composite insulating material comprising super absorbent poly... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,919, issued on April 21, was assigned to Hyundai Motor Co. (Seoul, South Korea), Kia Corp. (Seoul, South Korea), Korea Vilene Co. Ltd. (Pye... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,920, issued on April 21, was assigned to Whirlpool Corp. (Benton Harbor, Mich.). "Transparent tinted coating for appliance exterior panels... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,921, issued on April 21, was assigned to RKW SE (Mannheim, Germany). "Film packaging having cavities and being oriented in the direction o... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,923, issued on April 21, was assigned to IOW LLC (Renton, Wash.). "Packaging material having expandable layers" was invented by Timothy Al... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,924, issued on April 21, was assigned to Canon K.K. (Tokyo). "Adhesive transfer method and adhesive transfer device" was invented by Takas... Read More