US Patent Issued to TDK on April 21 for "Substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,914, issued on April 21, was assigned to TDK Corp. (Tokyo).

"Substrate processing apparatus" was invented by Yohei Sato (Tokyo), Hiroshi Koizumi (Tokyo), Toshinobu Miyagoshi (Tokyo), Osamu Shindo (Tokyo), Seijiro Sunaga (Tokyo), Mitsuyoshi Makida (Tokyo), Makoto Yamashita (Tokyo), Yasuo Kato (Tokyo), Ryo Shindo (Tokyo) and Masashi Matsumoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus 10 applies pressure to a substrate 2 which is an object to be pressurized arranged on an upper jig plate 44. The substrate processing apparatus 10 includes a lower jig plate 46 arranged below the upper jig plate 44, an install...