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US Patent Issued to Ferroelectric Memory on Oct. 20 for "Memory cell and method for changing properties of an electrode" (German Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,456, issued on Oct. 20, was assigned to Ferroelectric Memory GmbH (Dresden, Germany). "Memory cell and method for changing properties of an... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 20 for "Semiconductor device with ferroelectric layer and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,457, issued on Oct. 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device with ferroelec... Read More


US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Oct. 20 for "Semiconductor structure with vertical transistor and forming method therefor" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,458, issued on Oct. 20, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor structure with vertical trans... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 20 for "Vertical phase change memory device and related method" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,459, issued on Oct. 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Vertical phase change memory device... Read More


US Patent Issued to INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES on Oct. 20 for "Memory cell and manufacturing method thereof, three-dimensional memory and operation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,460, issued on Oct. 20, was assigned to INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES (Beijing). "Memory cell and manufacturin... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Oct. 20 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,461, issued on Oct. 20, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of fabricat... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Oct. 20 for "Semiconductor package including an adhesive structure" (South Korean Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,462, issued on Oct. 20, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including an adhesive ... Read More


US Patent Issued to Sandisk Technologies on Oct. 20 for "Packaged memory device with overhang support structure" (Chinese, Malaysian Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,464, issued on Oct. 20, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Packaged memory device with overhang support structu... Read More


US Patent Issued to Sumitomo Electric Device Innovations on Oct. 20 for "Capacitor and method of manufacturing same" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,465, issued on Oct. 20, was assigned to Sumitomo Electric Device Innovations Inc. (Yokohama, Japan). "Capacitor and method of manufacturing... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 20 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,466, issued on Oct. 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and manufa... Read More