ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,564, issued on Oct. 20, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing method" was invented by Ichiro Mitsu... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,565, issued on Oct. 20, was assigned to KAO Corp. (Tokyo). "Method for cleaning object surface" was invented by Kanae Miyazaki (Tokyo). Ac... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,566, issued on Oct. 20, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing apparatus and substrate processing m... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,567, issued on Oct. 20, was assigned to LG Energy Solution Ltd. (Seoul, South Korea). "Foreign matter removal device" was invented by Sang ... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,569, issued on Oct. 20, was assigned to Acutek Corp. (Taoyuan City, Taiwan). "Method for controlling optical element driving mechanism" was... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,570, issued on Oct. 20, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Vibration device and imaging device" was invented by... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,571, issued on Oct. 20, was assigned to GOERTEK INC. (Weifang, China). "Acoustic drainage structure and electronic device" was invented by ... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,572, issued on Oct. 20, was assigned to Tetra Laval Holdings & Finance S.A. (Pully, Switzerland). "Cleaning in place unit, a cleaning in pl... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,573, issued on Oct. 20, was assigned to EBARA Corp. (Tokyo). "Abrasion detection device, abrasion detection method, substrate cleaning devi... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,574, issued on Oct. 20, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing device and maintenance method for su... Read More