MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088674 A) filed by Koninklijke Philips N. V. on July 21, 2026, for Motorized C-Arm System. Inventors in... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088675 A) filed by Koninklijke Philips N. V. on July 21, 2026, for Indicating Station Unavailability Aft... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088676 A) filed by Koninklijke Philips N. V. on July 21, 2026, for Cooling For X-Ray System Having At Le... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088677 A) filed by Koninklijke Philips N. V. on July 21, 2026, for Intravacular Measurement Of Blood Oxy... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088687 A) filed by Qualcomm Incorporated on July 21, 2026, for Cross-Link Interference Reporting. Inven... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088695 A) filed by Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno on July ... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088701 A) filed by Qualcomm Incorporated on July 21, 2026, for An Integrated Circuit Device Including A ... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088702 A) filed by Qualcomm Incorporated on July 21, 2026, for Integrated Device Comprising Extended Met... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088703 A) filed by Qualcomm Incorporated on July 21, 2026, for Video Headsets With Fluid-Based Cooling S... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088704 A) filed by Qualcomm Incorporated on July 21, 2026, for Package Substrate. Inventors include Kan... Read More