Intellectual Property India Publishes Patent Application for Integrated Device Comprising Extended Metallization Region For Pillar Interconnects

MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088702 A) filed by Qualcomm Incorporated on July 21, 2026, for Integrated Device Comprising Extended Metallization Region For Pillar Interconnects.

Inventors include Patil, Aniket; He, Dongming; and Lisk, Durodami.

The application for the patent was published on July 24, 2026, under issue no. 30/2026.

Abstract: An integrated device comprising a die substrate; a die interconnection portion coupled to the die substrate, wherein the die interconnection portion comprises: at least one die dielectric layer; and a plurality of die interconnects, wherein the die interconnection portion comprises: an inner die interconnection portion; and a periphery ...