ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,687, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Circuit apparatus for electronic devices" was invented by Jeff ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,688, issued on July 14, was assigned to TDK Corp. (Tokyo). "Electronic component embedded substrate and manufacturing method therefor" was ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,689, issued on July 14, was assigned to Honeywell Federal Manufacturing & Technologies LLC (Kansas City, Mo.). "Transparent package for use... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,690, issued on July 14, was assigned to PANELSEMI Corp. (New Taipei City, Taiwan). "Electronic device" was invented by Chin-Tang Li (New Ta... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,691, issued on July 14, was assigned to VueReal Inc. (Waterloo, Canada). "Selective transfer of micro devices" was invented by Gholamreza C... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,692, issued on July 14, was assigned to FANUC Corp. (Yamanashi, Japan). "Printed circuit board and dynamic brake circuit comprising same" w... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,693, issued on July 14, was assigned to SEIKO EPSON Corp. (Japan). "Sensor module" was invented by Hitoshi Ueno (Shiojiri, Japan). Accordi... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,694, issued on July 14, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan). "Package structure" was invented by Yu-... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,695, issued on July 14, was assigned to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co. LTD. (Hebei Province, China), AVARY HOLDING (SHE... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,696, issued on July 14, was assigned to Apple Inc. (Cupertino, Calif.). "Transfer molding systems for semiconductor device packaging" was i... Read More