US Patent Issued to SEIKO EPSON on July 14 for "Sensor module" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,693, issued on July 14, was assigned to SEIKO EPSON Corp. (Japan).

"Sensor module" was invented by Hitoshi Ueno (Shiojiri, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor module includes a circuit board, a sensor element having a detection axis along a planar direction of the circuit board, a sensor package accommodating the sensor element and mounted on the circuit board, a board land pattern used for mounting the sensor package disposed on the circuit board, and a package electrode disposed on a mounting surface of the sensor package facing the circuit board and joined to the board land pattern by a solder. A relationship of Xpless t...