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US Patent Issued to SEMES on July 28 for "Heating unit and substrate treating apparatus including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,713, issued on July 28, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea). "Heating unit and substrate treating apparatus inc... Read More


US Patent Issued to CI SYSTEMS (ISRAEL) on July 28 for "Synchronization between temperature measurement device and radiation sources" (Israeli Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,714, issued on July 28, was assigned to CI SYSTEMS (ISRAEL) LTD. (Migdal Haemek, Israel). "Synchronization between temperature measurement ... Read More


US Patent Issued to Applied Materials on July 28 for "Fin structures, plate apparatus, and related methods, process kits, and processing chambers for growth rates and process uniformity" (California Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,715, issued on July 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Fin structures, plate apparatus, and related methods... Read More


US Patent Issued to ETEL on July 28 for "Z-rotary wafer positioning stage comprising a lift-pin mechanism" (Swiss Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,716, issued on July 28, was assigned to ETEL S.A. (Motiers, Switzerland). "Z-rotary wafer positioning stage comprising a lift-pin mechanism... Read More


US Patent Issued to APPLIED MATERIALS on July 28 for "Inspection system" (Israeli, German Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,717, issued on July 28, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.). "Inspection system" was invented by Asaf Schlezinger ... Read More


US Patent Issued to Ciena on July 28 for "Carrier for securing fabricated wafers" (Canadian Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,718, issued on July 28, was assigned to Ciena Corp. (Hanover, Md.). "Carrier for securing fabricated wafers" was invented by Simon Savard (... Read More


US Patent Issued to GUDENG PRECISION INDUSTRIAL on July 28 for "Substrate container equipped with stabilizing support and smooth tray connection" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,719, issued on July 28, was assigned to GUDENG PRECISION INDUSTRIAL Co. LTD. (New Taipei, Taiwan). "Substrate container equipped with stabi... Read More


US Patent Issued to Daifuku on July 28 for "Travel facility" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,720, issued on July 28, was assigned to Daifuku Co. Ltd. (Osaka, Japan). "Travel facility" was invented by Yoshinari Wada (Hinocho, Japan) ... Read More


US Patent Issued to BEIJING NAURA MICROELECTRONICS EQUIPMENT on July 28 for "Furnace tube assembly and disassembly auxiliary device" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,721, issued on July 28, was assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT Co. LTD. (Beijing). "Furnace tube assembly and disassembly... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Wafer container" (South Korean Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,722, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Wafer container" was invented by Wonguk S... Read More