ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,048, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Interconnect structure for fron... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,049, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and method" w... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,050, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Fabricating method of semicondu... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,051, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Kihon... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,052, issued on Aug. 11, was assigned to Micron Technology Inc. (Boise, Idaho). "Data storage device with light emitted memory" was invented... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,053, issued on Aug. 11, was assigned to Adeia Semiconductor Technologies LLC (San Jose, Calif.). "Direct-bonded optoelectronic devices" was... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,054, issued on Aug. 11, was assigned to BEIJING BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,055, issued on Aug. 11, was assigned to Murata Manufacturing Co. Ltd. (Kyoto-fu, Japan). "Substrate structure, module, method for manufactu... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,056, issued on Aug. 11, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin City, China). "Fan-out packaging structure and method fo... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,057, issued on Aug. 11, was assigned to QUALCOMM Inc. (San Diego). "Package comprising sidewall interconnects configured for power routing"... Read More