ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,056, issued on Aug. 11, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin City, China).
"Fan-out packaging structure and method for manufacturing same" was invented by Yenheng Chen (Jiangyin City, China) and Chengchung Lin (Jiangyin City, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A fan-out packaging structure and a method for manufacturing the same are provided. The structure comprises: a fan-out substrate unit, and a secondary fan-out unit; an effective electrical connection between a second top surface of the fan-out substrate unit and a third bottom surface of the secondary fan-out unit is formed through a second solder array,...