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US Patent Issued to GUANGZHOU CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY on April 14 for "Display panel and mobile terminal" (Chinese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,582, issued on April 14, was assigned to GUANGZHOU CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY Co. LTD. (Guangzhou, China).... Read More


US Patent Issued to Plessey Semiconductors on April 14 for "Hybrid microdisplay" (British Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,583, issued on April 14, was assigned to Plessey Semiconductors Ltd (Plymouth Devon, Great Britain). "Hybrid microdisplay" was invented by... Read More


US Patent Issued to Plessey Semiconductors on April 14 for "Hybrid microdisplay" (British Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,583, issued on April 14, was assigned to Plessey Semiconductors Ltd (Plymouth Devon, Great Britain). "Hybrid microdisplay" was invented by... Read More


US Patent Issued to CreeLED on April 14 for "Liquid metal alloys in a light-emitting diode device" (North Carolina, Ohio Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,584, issued on April 14, was assigned to CreeLED Inc. (Durham, N.C.). "Liquid metal alloys in a light-emitting diode device" was invented ... Read More


US Patent Issued to CreeLED on April 14 for "Liquid metal alloys in a light-emitting diode device" (North Carolina, Ohio Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,584, issued on April 14, was assigned to CreeLED Inc. (Durham, N.C.). "Liquid metal alloys in a light-emitting diode device" was invented ... Read More


US Patent Issued to JAPAN DISPLAY on April 14 for "Microled connection with cu bump on ti/al wire" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,585, issued on April 14, was assigned to JAPAN DISPLAY INC. (Tokyo). "Microled connection with cu bump on ti/al wire" was invented by Yosh... Read More


US Patent Issued to JAPAN DISPLAY on April 14 for "Microled connection with cu bump on ti/al wire" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,585, issued on April 14, was assigned to JAPAN DISPLAY INC. (Tokyo). "Microled connection with cu bump on ti/al wire" was invented by Yosh... Read More


US Patent Issued to Samsung Display on April 14 for "Display apparatus" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,586, issued on April 14, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display apparatus" was invented by Soohong Ch... Read More


US Patent Issued to Samsung Display on April 14 for "Display apparatus" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,586, issued on April 14, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display apparatus" was invented by Soohong Ch... Read More


US Patent Issued to HKC on April 14 for "Backlight module and display device" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,587, issued on April 14, was assigned to HKC CORPORATION LIMITED (Shenzhen, China). "Backlight module and display device" was invented by ... Read More