ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,585, issued on April 14, was assigned to JAPAN DISPLAY INC. (Tokyo).
"Microled connection with cu bump on ti/al wire" was invented by Yoshikatsu Imazeki (Tokyo) and Yoichi Kamijo (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device has: a substrate; a wiring formed on the substrate; an inorganic insulating layer covering the wiring; and a bump electrode that is connected to the wiring at a position of overlapping a first opening formed in the inorganic insulating layer and protrudes form the inorganic insulating layer. The wiring is a laminated film of: a first conductor layer made of titanium or a titanium alloy and formed on...