ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,739, issued on April 14, was assigned to JCET STATS ChipPAC Korea Ltd. (South Korea). "Semiconductor device and method of forming a 3-D st... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,740, issued on April 14, was assigned to XILINX INC. (San Jose, Calif.). "Chip package with integrated embedded off-die inductors" was inv... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,740, issued on April 14, was assigned to XILINX INC. (San Jose, Calif.). "Chip package with integrated embedded off-die inductors" was inv... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,741, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Deep trench capacitor (DTC) regio... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,741, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Deep trench capacitor (DTC) regio... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,742, issued on April 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Layout design method and stru... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,742, issued on April 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Layout design method and stru... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,743, issued on April 14, was assigned to LPKF LASER & ELECTRONICS AG (Garbsen, Germany). "Method for making a recess or opening into a pla... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,743, issued on April 14, was assigned to LPKF LASER & ELECTRONICS AG (Garbsen, Germany). "Method for making a recess or opening into a pla... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,744, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Integration of glass core into electronic substrates for fine... Read More