US Patent Issued to XILINX on April 14 for "Chip package with integrated embedded off-die inductors" (California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,740, issued on April 14, was assigned to XILINX INC. (San Jose, Calif.).

"Chip package with integrated embedded off-die inductors" was invented by Hong Shi (Los Gatos, Calif.), Li-Sheng Weng (San Diego), Frank Peter Lambrecht (San Jose, Calif.), Jing Jing (San Jose, Calif.) and Shuxian Wu (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package and method for fabricating the same are provided that includes embedded off-die inductors coupled in series. One of the off-die inductors is disposed in a redistribution layer formed on a bottom surface of an integrated circuit (IC) die. The other of the series connected off-die induct...