US Patent Issued to STATS ChipPAC on Sept. 1 for "Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages" (Singaporean, Chinese Inventors)

Posted On: 2026-09-01

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,502, issued on Sept. 1, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of using a standardized carri... Read More

US Patent Issued to Kulicke and Soffa Industries on Sept. 1 for "Wire guides, wire bonding systems, and related methods" (California, Texas Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,503, issued on Sept. 1, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Wire guides, wire bonding systems, and r... Read More

US Patent Issued to WIN SEMICONDUCTORS on Sept. 1 for "Semiconductor structure" (Taiwanese Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,504, issued on Sept. 1, was assigned to WIN SEMICONDUCTORS CORP. (Taoyuan City, Taiwan). "Semiconductor structure" was invented by Shao-Yu ... Read More

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Sept. 1 for "Method for reducing warpage occurred to substrate during packaging process" (Taiwanese Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,505, issued on Sept. 1, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Method for reducing warpage occurred ... Read More

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Sept. 1 for "Chip package structure and method for producing the same" (Taiwanese Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,506, issued on Sept. 1, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taoyuan City, Taiwan). "Chip package structure and method fo... Read More

US Patent Issued to Huizhou China Star Optoelectronics Display on Sept. 1 for "Substrate encapsulating method, display panel, and display device" (Chinese Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,507, issued on Sept. 1, was assigned to Huizhou China Star Optoelectronics Display Co. Ltd. (Huizhou, China). "Substrate encapsulating meth... Read More

US Patent Issued to BOE Technology Group on Sept. 1 for "Light emitting baseplates and methods of manufacturing the same, and display devices" (Chinese Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,508, issued on Sept. 1, was assigned to BOE Technology Group Co. Ltd. (Beijing). "Light emitting baseplates and methods of manufacturing th... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Hybrid element substrate and method of fabricating the same" (South Korean Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,509, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Hybrid element substrate and method of fabri... Read More

US Patent Issued to FUZHOU BOE OPTOELECTRONICS TECHNOLOGY, BOE TECHNOLOGY GROUP on Sept. 1 for "Light-emitting module and method of manufacturing the same, display apparatus" (Chinese Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,510, issued on Sept. 1, was assigned to FUZHOU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Fuzhou, China) and BOE TECHNOLOGY GROUP Co. LTD. (Be... Read More

US Patent Issued to LG Electronics on Sept. 1 for "Semiconductor light emitting device package for display pixel and display device including the same" (South Korean Inventors)

Posted On: 2026-09-01

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ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,511, issued on Sept. 1, was assigned to LG Electronics Inc. (Seoul, South Korea). "Semiconductor light emitting device package for display ... Read More

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US Patent Issued to STATS ChipPAC on Sept. 1 for "Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages" (Singaporean, Chinese Inventors)

US Patent Issued to Kulicke and Soffa Industries on Sept. 1 for "Wire guides, wire bonding systems, and related methods" (California, Texas Inventors)

US Patent Issued to WIN SEMICONDUCTORS on Sept. 1 for "Semiconductor structure" (Taiwanese Inventors)

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Sept. 1 for "Method for reducing warpage occurred to substrate during packaging process" (Taiwanese Inventors)

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Sept. 1 for "Chip package structure and method for producing the same" (Taiwanese Inventors)

US Patent Issued to Huizhou China Star Optoelectronics Display on Sept. 1 for "Substrate encapsulating method, display panel, and display device" (Chinese Inventors)

US Patent Issued to BOE Technology Group on Sept. 1 for "Light emitting baseplates and methods of manufacturing the same, and display devices" (Chinese Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Hybrid element substrate and method of fabricating the same" (South Korean Inventors)

US Patent Issued to FUZHOU BOE OPTOELECTRONICS TECHNOLOGY, BOE TECHNOLOGY GROUP on Sept. 1 for "Light-emitting module and method of manufacturing the same, display apparatus" (Chinese Inventors)

US Patent Issued to LG Electronics on Sept. 1 for "Semiconductor light emitting device package for display pixel and display device including the same" (South Korean Inventors)