US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Sept. 1 for "Chip package structure and method for producing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,506, issued on Sept. 1, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taoyuan City, Taiwan).

"Chip package structure and method for producing the same" was invented by Jui-Hung Hsu (Taoyuan City, Taiwan), Yu-Wen Li (Taoyuan City, Taiwan) and Li-Chun Hung (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; placing a chip upside-down on the substrate; forming bonding wires coupled with the chip and the substrate; providing at least one reflecting member on an upper surface of the substrate, forming a...