ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,695, issued on April 7, was assigned to SEG Automotive Germany GmbH (Stuttgart, Germany). "Half-bridge switch arrangement" was invented by ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,696, issued on April 7, was assigned to AT&S (Chongqing) Co. Ltd. (Chongqing, China). "Component carrier and method of manufacturing the sa... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,697, issued on April 7, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Circuit board and multilayer circuit board" was inve... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,698, issued on April 7, was assigned to NITTO DENKO Corp. (Osaka, Japan). "Wiring circuit board" was invented by Yusaku Tamaki (Osaka, Japa... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,699, issued on April 7, was assigned to LOTTE ENERGY MATERIALS CORPORATON (Jeollabuk-do, South Korea). "Ultra-thin copper foil with carrier... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,700, issued on April 7, was assigned to KYOCERA Corp. (Kyoto, Japan). "Wiring board" was invented by Hiroaki Sano (Kagoshima, Japan), Toshi... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,701, issued on April 7, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with selection structure an... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,702, issued on April 7, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board" was invented by... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,703, issued on April 7, was assigned to NITTO DENKO Corp. (Osaka, Japan). "Wiring circuit board" was invented by Shusaku Shibata (Osaka, Ja... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,704, issued on April 7, was assigned to Hyundai Mobis Co. Ltd. (Seoul, South Korea). "Apparatus and method for manufacturing power module" ... Read More