US Patent Issued to MURATA MANUFACTURING on April 7 for "Circuit board and multilayer circuit board" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,697, issued on April 7, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Circuit board and multilayer circuit board" was invented by Takayuki Shimamura (Nagaokakyo, Japan), Tomohiro Furumura (Nagaokakyo, Japan) and Sunao Fukutake (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board includes, in order in a stacking direction, a first insulating layer, a second insulating layer in contact with the first insulating layer, and a conductor layer, the first insulating layer includes a liquid crystal polymer as a main component, and the second insulating layer includes a fluoropolymer including at least one of pol...