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International Patent: OPTIMAL MEMORY CONFIGURATIONS IN A SILICON INTERPOSER FOR HIGH-SPEED DRAM

GENEVA, Sept. 18 -- XILINX, INC. filed a patent application (US2026/016179) for “OPTIMAL MEMORY CONFIGURATIONS IN A SILICON INTERPOSER FOR HIGH-SPEED DRAM”. With publication no. WO/2026/187524, here a... Read More


International Patent: OPTIMAL MEMORY CONFIGURATIONS IN A SILICON INTERPOSER FOR HIGH-SPEED DRAM

GENEVA, Sept. 18 -- XILINX, INC. filed a patent application (US2026/016179) for “OPTIMAL MEMORY CONFIGURATIONS IN A SILICON INTERPOSER FOR HIGH-SPEED DRAM”. With publication no. WO/2026/187524, here a... Read More


International Patent: AUGMENTED AND VIRTUAL REALITY OBJECT-AWARE HAND TRACKING

GENEVA, Sept. 18 -- SNAP INC. filed a patent application (US2026/016185) for “AUGMENTED AND VIRTUAL REALITY OBJECT-AWARE HAND TRACKING”. With publication no. WO/2026/187525, here are the other details... Read More


International Patent: AUGMENTED AND VIRTUAL REALITY OBJECT-AWARE HAND TRACKING

GENEVA, Sept. 18 -- SNAP INC. filed a patent application (US2026/016185) for “AUGMENTED AND VIRTUAL REALITY OBJECT-AWARE HAND TRACKING”. With publication no. WO/2026/187525, here are the other details... Read More


International Patent: HIGH BANDWIDTH DIMM ARCHITECTURE

GENEVA, Sept. 18 -- TACHYUM LTD. filed a patent application (US2026/016238) for “HIGH BANDWIDTH DIMM ARCHITECTURE”. With publication no. WO/2026/187526, here are the other details related to the paten... Read More


International Patent: HIGH BANDWIDTH DIMM ARCHITECTURE

GENEVA, Sept. 18 -- TACHYUM LTD. filed a patent application (US2026/016238) for “HIGH BANDWIDTH DIMM ARCHITECTURE”. With publication no. WO/2026/187526, here are the other details related to the paten... Read More


International Patent: INTEGRATED COOLING ASSEMBLY WITH UPPER AND LOWER CHANNELS AND CO-PACKAGED OPTICS

GENEVA, Sept. 18 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. filed a patent application (US2026/016088) for “INTEGRATED COOLING ASSEMBLY WITH UPPER AND LOWER CHANNELS AND CO-PACKAGED OPTICS”. Wit... Read More


International Patent: INTEGRATED COOLING ASSEMBLY WITH UPPER AND LOWER CHANNELS AND CO-PACKAGED OPTICS

GENEVA, Sept. 18 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. filed a patent application (US2026/016088) for “INTEGRATED COOLING ASSEMBLY WITH UPPER AND LOWER CHANNELS AND CO-PACKAGED OPTICS”. Wit... Read More


International Patent: POUCH ASSEMBLY FOR A HANDHELD RADIO

GENEVA, Sept. 18 -- MOTOROLA SOLUTIONS, INC. filed a patent application (US2026/016169) for “POUCH ASSEMBLY FOR A HANDHELD RADIO”. With publication no. WO/2026/187522, here are the other details relat... Read More


International Patent: POUCH ASSEMBLY FOR A HANDHELD RADIO

GENEVA, Sept. 18 -- MOTOROLA SOLUTIONS, INC. filed a patent application (US2026/016169) for “POUCH ASSEMBLY FOR A HANDHELD RADIO”. With publication no. WO/2026/187522, here are the other details relat... Read More