International Patent: INTEGRATED COOLING ASSEMBLY WITH UPPER AND LOWER CHANNELS AND CO-PACKAGED OPTICS

GENEVA, Sept. 18 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. filed a patent application (US2026/016088) for “INTEGRATED COOLING ASSEMBLY WITH UPPER AND LOWER CHANNELS AND CO-PACKAGED OPTICS”. With publication no. WO/2026/187521, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 40/47

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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